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- PDR IR-E3 PRO rework station for big PCB
PDR IR-E3 PRO rework station for big PCB
PDR E3 PRO – Advanced BGA Rework System for big boards
A high-precision infrared (IR) rework system designed for professional removal and replacement of BGA, QFN, CSP and other SMD components. Advanced optical alignment, controlled three-zone PCB preheating and precise thermal process management deliver repeatable rework results on large PCBs and demanding electronic assemblies.
- Advanced Focused IR component heating
- Quartz IR PCB preheating with dual-zone
- 12”/300mm PCB Capacity
- Split Beam prism system for simultaneous PCB/component viewing
- Precision Components Pick and Placement up to 10um
- Professional PCB handling
- Component Nest/Flux Application Facility
- Closed Loop Non-Contact Temperature Sensing
- Advanced Automatic Thermal Process Control
Technical Specifications
| Parameter | Specification |
|---|---|
| System type | IR BGA/SMD rework system |
| Maximum PCB size | 620 × 620 mm |
| Maximum component size | 85 × 85 mm |
| Minimum component size | 01005 |
| Component removal | Manual vacuum pick-up system |
| Component alignment | Split-beam prism optical system, 50× magnification |
| Placement accuracy | Up to 10 µm |
| Top IR heater power | 150 W |
| IR heating spot diameter | Up to 100 mm, depending on configuration |
| PCB preheater power | 2800 W |
| PCB preheating technology | Medium-wave IR, 3 zones |
| PCB preheating area | 360 × 240 mm |
| Component temperature sensing | Non-contact IR sensor |
| PCB temperature sensing | Thermocouple (TC); non-contact IR sensor optional |
| Thermocouple channels | 4 |
| Thermal profile control | PDR ThermoActive automatic profiling software |
| Power supply | 208–240 V AC, 50/60 Hz |
| Workbench footprint | 1400 × 600 mm |
| Weight | 65 kg |
Optional equipment: large-component IR heating head, side-view camera, PCB cooling system and additional temperature sensor.
