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PDR IR-E3 rework station for all PCB
PDR E3 – Professional BGA Rework System
A high-performance infrared (IR) rework system designed for precise removal and placement of BGA, QFN, CSP and other SMD components. Focused IR heating, multi-zone PCB preheating and advanced thermal process control enable accurate, repeatable rework while helping protect sensitive components and PCBs from thermal damage.
- Advanced Focused IR component heating
- Quartz IR PCB preheating with dual-zone
- Split Beam prism system for simultaneous PCB/component viewing
- Precision Components Pick and Placement up to 10um
- Professional PCB handling
- Component Nest/Flux Application Facility
- Closed Loop Non-Contact Temperature Sensing
- Advanced Automatic Thermal Process Control
- Reflow Process Observation Camera
- PCB Forced Air Cooling
Technical Specifications
| Parameter | Specification |
|---|---|
| System type | IR BGA/SMD rework system |
| Maximum PCB size | 300 × 450 mm |
| Maximum component size | 55 × 55 mm |
| Minimum component size | 01005 |
| Component placement accuracy | Up to 10 µm |
| Top IR heater power | 150 W |
| IR heating spot diameter | Up to 70 mm |
| PCB preheater power | 2800 W |
| PCB preheating zones | 3 |
| PCB preheating area | 360 × 240 mm |
| Component temperature sensing | Non-contact IR sensor |
| PCB temperature sensing | Thermocouple (TC) |
| Thermocouple channels | 4 |
| Component alignment | Split-beam prism system, 50× magnification |
| Control software | PDR ThermoActive with automatic thermal profiling |
| Power supply | 208–240 V AC, 50/60 Hz |
| Maximum total power | Depends on configuration |
| Workbench footprint | 1400 × 600 mm |
| Weight | 65 kg |
Specifications and optional features may vary depending on the selected system configuration.
