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X3 3D X-Ray Inspection machine

 

Nordson YESTECH.s versatile X3 Automated X-Ray Inspection
System (AXI) offers complete inspection of solder joints and
other critical hidden features found in electronic assemblies,
PCB.s and packaged semiconductors. Ideal for in-line or off-line
operation, the X3.s innovative algorithms enable fast and reliable
automated inspection and real-time monitoring of critical
process information.

 

Features:

 

  • Automated 2D & 3D inspection
  • Unsurpassed image quality
  • High defect detection
  • Low false calls
  • Fast throughput
  • Quick set-up

 

Automated Inspection for:

 

  • Opens & shorts
  • Insufficient / excess solder
  • Lifted leads & tombstoned parts
  • BGA 
  • Voids
  • Component presence and position