It has been estimated that 51-72% of all solder defects are a result of the screen-printing operation. Thus having
a clean and accurate stencil is a major concern. An SMT stencil that has maintained good structural integrity and
has zero contamination within the apertures will produce a better and more consistent print, which reduces
incidence of misprints and downtime.
Additionally V-SC 200 can be used for underside wipe cleaning in SMT printers.
Removes all solder pastes and all SMT adhesives