S2-910 Series Scalable Dispensers for PCB Assembly and Microelectronics Packaging
The S2-910 is ideal for dispensing applications that do not require heat, such as surface mount adhesive (SMA), silver epoxy, solder paste, and edge- and corner-bonding applications. The redesigned motion system delivers improved wet dispense accuracy and repeatability with single or dual valves and high-precision Z-axis control; enabling dispensing in applications previously impossible with older models.
The Spectrum II S2-910 series’ modular design allows for easy adaptation and upgrading to accommodate new applications and production requirements. As your manufacturing requirements change so can your equipment. The minimal floor space design, only 600 mm wide when configured without pre- and post-queue stations, the S2-910 delivers excellent productivity per square meter and maximizes your production floor profitability.
The S2-910 is ideal for:
- Surface mount adhesives
- Medium- to high-viscosity solder pastes
- Conductive adhesives
- Corner- and edge- bonding