IS-B-460
IS-B-460 – High speed and high flexibility!
The IS-B-460 impresses with its many types of equipment variants, this system can be provided with a second solder pot to either use two different solder alloys without having to physically change the solder pot or work with two different nozzle sizes - a small nozzle for soldering points in high density areas and a large nozzle for large connectors.
Alternatively, the system can be configured with a second solder pot for parallel soldering of two circuit boards simultaneously, which doubles the through-put of the IS-B-460.
With only 1.8 m² footprint this system requires much less space than competing systems. The IS-B-460 can be seamlessly integrated into the production environment of a manufacturing cell.
IS-B460 S
„S“ stands for “Single“, which refers to the configuration with one titanium solder pot and one MicroDrop Fluxer.
IS-B460 D
IS-B460 P
Model Name | IS-B-460 |
---|---|
Max. board size | 460 x 460 mm |
Machine dimension | L:1268 x W:1430 x H:1560 mm |
Weight | 420 kg |
Infrared Pre-heater |
Top: 1,5 - 6 kW; Bottom: 1,5 - 6 kW; Preheat area: 460 x 460 mm; |
Solder module |
Up to two solder modules with capacity of 12 kg (22 lbs) of eatch; Lead free titanium solder pot and pump system; Suitable for all alloys; |
Nitrogen |
Pressure: max. 4 bar; Consumption: 1,3 – 3 m3/h (adjustable); Purity: 99,99%; |
Flux system | Maintenance free "Micro Drop Jet" system; |
Heat up time | 45 - 60 minutes; |
Max. temperature |
320°C |