IS-B-460 – High speed and high flexibility!
The IS-B-460 impresses with its many types of equipment variants, this system can be provided with a second solder pot to either use two different solder alloys without having to physically change the solder pot or work with two different nozzle sizes - a small nozzle for soldering points in high density areas and a large nozzle for large connectors.
Alternatively, the system can be configured with a second solder pot for parallel soldering of two circuit boards simultaneously, which doubles the through-put of the IS-B-460.
With only 1.8 m² footprint this system requires much less space than competing systems. The IS-B-460 can be seamlessly integrated into the production environment of a manufacturing cell.
„S“ stands for “Single“, which refers to the configuration with one titanium solder pot and one MicroDrop Fluxer.
|Max. board size||460 x 460 mm|
|Machine dimension||L:1268 x W:1430 x H:1560 mm|
Top: 1,5 - 6 kW;
Bottom: 1,5 - 6 kW;
Preheat area: 460 x 460 mm;
Up to two solder modules with capacity of 12 kg (22 lbs) of eatch;
Lead free titanium solder pot and pump system;
Suitable for all alloys;
Pressure: max. 4 bar;
Consumption: 1,3 – 3 m3/h (adjustable);
|Flux system||Maintenance free "Micro Drop Jet" system;|
|Heat up time||45 - 60 minutes;|