IS-B-335 – Highest quality at a low price!
The big advantages of the IS-B-335 are the large soldering area with the possibility to handle board of 335x335mm and the small machine size. The machine is equipped with titan solder pot, MicroDrop Fluxer and a wide range of other features and options making it ready for the technological challenges of the future.
The IS-B-335 combines small machine size, a large soldering area and flexible configurations. The smart buildup design provides professional results for selective soldering for an economical reasonable price. In the production environment of manufacturing cells the IS-B-335 can fit seamlessly.
Thanks to the front-mounted 2-way handling one circuit board can be prepared while another PCB is already being soldered.The reasonable price and the low operating cost of the IS-B-335 (e.g. by low nitrogen and power consumption) makes this system the most popular IS soldering machine worldwide.
|Max. board size||335 x 335 mm|
|Machine dimension||L:1020 x W:1020 x H:1480 mm|
Top: 1,5 - 4,5 kW;
Bottom: 1,5 - 4,5 kW;
Preheat area: 335 x 335 mm;
One solder module with capacity of 12 kg (22 lbs);
Lead free titanium solder pot and pump system;
Suitable for all alloys;
Pressure: max. 4 bar;
Consumption: 1,3 – 2 m3/h (adjustable);
|Flux system||Maintenance free "Micro Drop Jet" system;|
|Heat up time||45 - 60 minutes;|