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BX AOI - Optical Inspection machine

 

 

Nordson YESTECH’s advanced 5 megapixel color camera
imaging technology offers benchtop PCB inspection with
exceptional defect coverage. This benchtop system inspects 

solder joints and verifies correct part assembly enabling users
to improve quality and increase throughput. The optional four
side viewing cameras add additional inspection capabilities
found only on in-line systems.

 

Features:


• 5 megapixel color imaging
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage
• Low false failure rate

 

Automated Inspection for:


• Solder defects
• Lead defects
• Component presence and position
• Correct part / polarity
• Through-hole parts
• Paste