LT EN

iX-502/302


Scalable Output - High first pass yield

 

With software optimizing factory processes efficiently, the iX-302 and iX-502 simply blends into your factory. The truly modular single sided concept simplifies use and offers complete control and overview from one side only in a volume environment.


Industrie's most controlled placement process
The unique feature of the iX is its optimized control of each and every individual placement resulting into the highest first-pass yield in the industry. It minimizes the costs associated with repair and possible scrapping. In addition, the high quality of your manufactured product assures end-user satisfaction, with minimal warranty recalls by the final consumer. 


The unique placement process features:

  • Advanced PCB collision detection mechanism ('when does the component touch the board')
  • No impact force = No component cracking
  • Real-time closed-loop placement force control to place the part at the specified placment force
  • Placement process verification (according blue-print value)  - Always check the reliablilty of each individual placement
  • PCB surface mapping allows all other placement heads to place without impact on the learned placement height.


Benefits

  • Conceptually smooth machine movement: low maintenance, reliable component handling and a continuous basis for accuracy, 24 hours a day, 7 days a week - year after year.
  • Fully software controlled pick and place cycle: controlled pick, optimum acceleration and deceleration process, monitoring and controlled placement: No damage to components.
  • All individucal placements follow 'blue-print' values, making sure only correct PCBs leave the line.
  • Proven reliability of fewer than 1 defect per million placement performance.
  • Capacity can be added or removed in order to increase or decrease output without altering the line footprint: True capacity on demand
 
 

SPECIFICATIONS:

 iX-502iX-302
Maximum output per hour:
 
165 k
(121k IPC 9850(A))
99k
(79k IPC 9850(A))   
Placement quality *: < 1 dpm < 1 dpm
Placement accuracy CpK > 1 *
 
35 micron for chips
25 micron for QFP
35 micron for chips
25 micron for QFP
Minimum component size (LxW): 0.4 x 0.2 mm (01005) 0.4 x 0.2 mm (01005)
Maximum component size (LxW):         45 x 45 mm 45 x 45 mm
Maximum component height (LxW)
Standard:
Optional:

10.5 mm
12 mm**

10.5 mm
12 mm**
Programmable placement force: 1.5 to 8 N 1.5 to 8 N
Maximum board size (LxW)
Standard:

Optional:
 

515 x 390 mm
(20.28 x 15.35")
800 x 457 mm
(31.5 x 18")

475 x 390 mm
(18.7 x 15.35")
800 x 457 mm
(31.5 x 18")
Minimum board size (LxW)
Standard:
Optional:

50 x 50 mm (2 x 2")
50 x 25 mm (2 x 1")

50 x 50 mm (2 x 2")
50 x 25 mm (2 x 1")
Board thickness
Standard:
Optional:

0.3 to 6 mm
10 mm

0.3 to 6 mm
10 mm
Automatic toolbit exchange: nozzles nozzles
Maximum tape feeding positions (8 mm)
 
260 twin tapes
130 single tapes
156 twin tapes
76 single tapes
Feeding options (special feeders on request):
 
tape, stick, tray, re-use
 
tape, stick, tray, re-use
 
Footprint (LxW) excluding feeders:
 
3,720 x 1,705 mm
(146.46 x 67.13")
2,760 x 1,705 mm
(108.66 x 67.13")